najoNanosystems: Physics, Chemistry, MathematicsНаносистемы: физика, химия, математика2220-80542305-7971Университет ИТМО10.17586/2220-8054-2015-6-3-332-345najo-869Research ArticlePHYSICSФИЗИКАModeling of the kinetics of reactive diffusion of gallium in copper particlesDzyubanenkoS. V.

49 Kronverkskiy, St. Petersburg, 197101

LukyanovV. D.

49 Kronverkskiy, St. Petersburg, 197101

lukyanovvd@rambler.ruITMO University; JSC AvangardRussian Federation20151508202563332–345Copyright © Dzyubanenko S.V., Lukyanov V.D., 20252025Dzyubanenko S.V., Lukyanov V.D.Dzyubanenko S.V., Lukyanov V.D.This work is licensed under a Creative Commons Attribution 4.0 License.https://nanojournal.ifmo.ru/jour/article/view/869

The results of experimental studies for the formation kinetics of an intermetallic compound in the diffusion of gallium in copper are discussed. The mathematical model for the experimental study made it possible to calculate the diffusion coefficient of gallium in copper. A mathematical model for the kinetics of intermetallic compound formation at the reactive diffusion of gallium in a copper particle allows one to estimate the solidification time for diffusion-curing paste-based solder consisting of molten gallium and copper powder.

reactive diffusionsoldergalliumcopperintermetallickineticsReferencesLashko N.F., Lashko S.V. Soldering of metals. Mechanical engineering, Moscow, 1988, 326 p.Lashko N.F., Lashko S.V. Soldering of metals. Mechanical engineering, Moscow, 1988, 326 p.Petrova A.P. Heat-resistant glues. Chemistry, Moscow, 1977, 200 p.Petrova A.P. Heat-resistant glues. Chemistry, Moscow, 1977, 200 p.Lashko S.V., Grishin V.L. Solders with gallium. Instrumentation making, 1965, 3, P. 6–11.Lashko S.V., Grishin V.L. Solders with gallium. Instrumentation making, 1965, 3, P. 6–11.Grzhimalsky L.L. Gallic solders. Leningrad: Knowledge, 1974.Grzhimalsky L.L. Gallic solders. Leningrad: Knowledge, 1974.MacKay C.A. Amalgams as alternative bonding materials. Soldering & Surface Mount Technology, 1990, 2, P. 21–25.MacKay C.A. Amalgams as alternative bonding materials. Soldering & Surface Mount Technology, 1990, 2, P. 21–25.Baldwin D.F. Amalgams As Alternative Microelectronic Interconnect Materials. Sensors in Electronic Pack aging, 1995, 2, P. 55–63.Baldwin D.F. Amalgams As Alternative Microelectronic Interconnect Materials. Sensors in Electronic Pack aging, 1995, 2, P. 55–63.Bhattacharya S.K. A low temperature processable ternary gallium alloy for via filling application in micro electronic packaging. Journal of Materials Science: Materials in Electronics, 2000, 11, P. 653–656.Bhattacharya S.K. A low temperature processable ternary gallium alloy for via filling application in micro electronic packaging. Journal of Materials Science: Materials in Electronics, 2000, 11, P. 653–656.Janssen Y. Differential thermal analysis and solution growth of intermetallic compounds. Journal of Crystal Growth, 2005, 285, P. 670–680.Janssen Y. Differential thermal analysis and solution growth of intermetallic compounds. Journal of Crystal Growth, 2005, 285, P. 670–680.Deng Yue-Guang. Corrosion development between liquid gallium and four typical metal substrates used in chip cooling device. Appl. Phys. A, 2009, 95 (3), P. 907–915.Deng Yue-Guang. Corrosion development between liquid gallium and four typical metal substrates used in chip cooling device. Appl. Phys. A, 2009, 95 (3), P. 907–915.Sommadossi S. Diffusion soldering using a gallium metallic paste as solder alloy: study of the phase formation systematic. Journal of Materials Science, 2007, 42, P. 9707–9712.Sommadossi S. Diffusion soldering using a gallium metallic paste as solder alloy: study of the phase formation systematic. Journal of Materials Science, 2007, 42, P. 9707–9712.Dzyubanenko S. Gallium Amalgam Solder as a Bonding Material for SAW Devices. Proceeding of “XIII International Conference for Young Researches ‘Wave Electronics and Its Applications in the Information and Telecommunication Systems”. Saint-Petersburg, June 2010, Saint-Petersburg State University of Aerospace Instrumentation, 2010, P. 34.Dzyubanenko S. Gallium Amalgam Solder as a Bonding Material for SAW Devices. Proceeding of “XIII International Conference for Young Researches ‘Wave Electronics and Its Applications in the Information and Telecommunication Systems”. Saint-Petersburg, June 2010, Saint-Petersburg State University of Aerospace Instrumentation, 2010, P. 34.Bugakov V.Z. Diffusion in metals and alloys. Moskow, GITTL, 1949, 122 p.Bugakov V.Z. Diffusion in metals and alloys. Moskow, GITTL, 1949, 122 p.Tikhonov A.N., Samarsky A.A. Equations of mathematical physics. Science, Moskow, 1977, 734 p.Tikhonov A.N., Samarsky A.A. Equations of mathematical physics. Science, Moskow, 1977, 734 p.Leybenzon L.S. Handbook of oil-field mechanics. Moskow– Leningrad: ONTI NKTP USSR, 1934, 196 p.Leybenzon L.S. Handbook of oil-field mechanics. Moskow– Leningrad: ONTI NKTP USSR, 1934, 196 p.Luikov A.V. Heat conductivity theory. Moskow, The Higher school, 1966, 600 p.Luikov A.V. Heat conductivity theory. Moskow, The Higher school, 1966, 600 p.Lukyanov V.D. Relationship plurality approximation. Nanosystems: Physics, Chemistry, Mathematics, 2014, 5 (3), P. 384–390.Lukyanov V.D. Relationship plurality approximation. Nanosystems: Physics, Chemistry, Mathematics, 2014, 5 (3), P. 384–390.

The authors declare that there are no conflicts of interest present.