Molecular-dynamic investigation of contact interaction of pure metals

Abstract

In using the method of molecular dynamics simulation of contact interaction between the copper crystallite and the various pure metals under shear loading was carried out. Shown that the structure of the boundary layer obtained during the shear deformation is determined by the loading conditions and materials of contact pair. In particular, in the interaction of copper with aluminum, soft aluminum material begins to be introduced into the lattice of copper, and in the interaction of copper with iron, this process is not observed. The effect of loading conditions and mode of heat transfer was studied. The research results can be useful for controlling strength properties of interfacial layer coated material, as well as to control the properties of the surface layer in contact problems.