Influence of copper nanoparticle film processing temperature on their structure and electrical properties
https://doi.org/10.17586/2220-8054-2018-9-5-586-596
Abstract
This work is devoted to the study of the influence of the additional processing at 100, 200 and 300 ◦C on the morphology, microrelief, elemental composition of the surface and the electrophysical properties of glass/ITO/copper nanoparticle film structures. Studies have shown that with an increase in the processing temperature of the investigating samples reduces the amount of organic matter protecting the copper particles from oxidation. The conductivity of copper nanoparticles increases. The morphology of the surface and the elemental composition of the samples were studied by scanning electron microscopy. The microrelief of the surface and the measurement of the copper nanoparticles current-voltage characteristics were carried out using a scanning probe microscope in atomic force and scanning tunneling microscopy modes.
Keywords
About the Authors
N. N. BegletsovaRussian Federation
Astrakhanskaya, 83, Saratov, 410012; Bolshaya Sadovaya, 239, Saratov, 410005
A. J. K. Al-Alwani
Russian Federation
Astrakhanskaya, 83, Saratov, 410012; Babylon, Iraq
A. S. Atkin
Russian Federation
Astrakhanskaya, 83, Saratov, 410012
V. P. Sevostyanov
Russian Federation
Bolshaya Sadovaya, 239, Saratov, 410005
E. G. Glukhovskoy
Russian Federation
Astrakhanskaya, 83, Saratov, 410012; Bolshaya Sadovaya, 239, Saratov, 410005
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Review
For citations:
Begletsova N.N., Al-Alwani A., Atkin A.S., Sevostyanov V.P., Glukhovskoy E.G. Influence of copper nanoparticle film processing temperature on their structure and electrical properties. Nanosystems: Physics, Chemistry, Mathematics. 2018;9(5):586-596. https://doi.org/10.17586/2220-8054-2018-9-5-586-596